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Determination of Lumped Element Package Model for Radio Frequency Surface Acoustic Wave Device Using Neural Network Techniques

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4 Author(s)
Shuming T. Wang ; Department of Electrical Engineering, I-Shou University, Kaohsiung, Taiwan, 840 ; Zhi-Feng Xie ; Tzu-Te Liu ; Rey-Chue Hwang

Electronic packaging has a significant influence on RF surface acoustic wave (SAW) device. Hence, how to incorporate packaging effects into SAW simulation is an important issue. In this paper, neural network was employed to determine the lumped element models of bonding pads. As an example, an RF SAW filter used in GPS system was examined. The result showed a good agreement with that obtained from full wave EM simulator.

Published in:

2007 Sixteenth IEEE International Symposium on the Applications of Ferroelectrics

Date of Conference:

27-31 May 2007