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Ru Atomic layer deposition (ALD) and anodic aluminum oxide (AAO) process were studied for fabrication of one dimensional metallic nanostructure. Low resistivity and very pure ruthenium thin films were deposited from bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] by thermal atomic layer deposition (ALD) using oxygen (O2) gas and plasma-enhanced ALD (PE-ALD) using ammonia (NH3) plasma. In addition, regularly ordered porous anodic aluminum oxide nanotemplates were fabricated on aluminum plate and Al film by multistep-step anodization method. The process conditions for Ru ALD process to fabricate metallic nanostructure by filling the nanotemplates were investigated.