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Smaller manufacturing processes have resulted in higher power densities which put greater emphasis on packaging and temperature control during test. For system-on-chips, peak power-based scheduling algorithms are used to optimize tests while satisfying power budgets. However, imposing power constraints does not necessarily mean that overheating is avoided due to the non-uniform power distribution across the chip. This paper presents a TAM/Wrapper co-design methodology for system-on-chips that ensures thermal safety while still optimizing the test schedule. The method combines a simplified thermal-cost model with a traditional bin-packing algorithm to minimize test time while satisfying temperature constraints. Experiments show that even minimal increases in test time can yield considerable decrease in test temperature as well as the possibility of further lowering temperatures beyond those achieved using traditional power-based test scheduling.