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A PCB Level Electromagnetic RF Modeling and Sco-imulation Platform for the Mobile Handset Application

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2 Author(s)
Yongsup Kim ; Telecommunication R&D Center, Samsung Electronics 416 Maetan-3Dong, Yeongtong-Gu, Suwon, Gyeonggi-Do, South Korea, 443-742. e-mail:, tel.: +82 31 2793620 ; Austin S. Kim

A RF co-simulation platform consisting PCB electromagnetic (EM) modeling and behavioral modeling has been proposed for the wireless handset application. Through integration of EM PCB pattern models, RF component models and RF transceiver behavioral models, complete RF co-simulation could be accomplished. Established simulation platform has been applied to 1800 MHz CDMA mobile phone (Korean PCS) and shows that simulation results are very close to measurement results. This co-simulation platform enables predicting RF performance before prototyping through analysis of S-parameter characteristics and overall RF functionalities such as ACPR, FER and STD.

Published in:

Electromagnetics in Advanced Applications, 2007. ICEAA 2007. International Conference on

Date of Conference:

17-21 Sept. 2007