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A RF co-simulation platform consisting PCB electromagnetic (EM) modeling and behavioral modeling has been proposed for the wireless handset application. Through integration of EM PCB pattern models, RF component models and RF transceiver behavioral models, complete RF co-simulation could be accomplished. Established simulation platform has been applied to 1800 MHz CDMA mobile phone (Korean PCS) and shows that simulation results are very close to measurement results. This co-simulation platform enables predicting RF performance before prototyping through analysis of S-parameter characteristics and overall RF functionalities such as ACPR, FER and STD.