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An Efficient Method for Power integrity and EMI Analysis of Irregular-Shaped Power/Ground Planes in Packages

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4 Author(s)
En-Xiao Liu ; Electromagnetics and Electronic System Programme, Institute of High Performance Computing Science Park II, Singapore 117528. Phone: (65)-64191111, Fax: (65)-64191380. Email: ; Xingchang Wei ; Zaw Zaw Oo ; Er-Ping Li

We developed a two-dimensional full wave method for efficient power integrity and EMI Analysis of general power/ground planes in high-speed electronic packages. The resultant equivalent magnetic source from the 2D simulation is used for EMI analysis via the free-space Green's function. Both analytical and experimental validation shows that the method is accurate and efficient.

Published in:

2007 IEEE Electrical Performance of Electronic Packaging

Date of Conference:

29-31 Oct. 2007