Referenced Items are not available for this document.
This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB's in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.
Published in:
Electrical Performance of Electronic Packaging, 2007 IEEE
Date of Conference: 29-31 Oct. 2007
- Page(s):
- 245 - 248
- Print ISBN:
- 978-1-4244-0883-2
- INSPEC Accession Number:
- 9727347
- Conference Location :
- Atlanta, GA
- Digital Object Identifier :
- 10.1109/EPEP.2007.4387172
- Product Type:
- Conference Publications
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