By Topic

Application of Integral Analysis Technique to Determine Signal- and Power Integrity of Advanced Packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Nebojsa Nenadovic ; NXP Semiconductors, Gerstweg 2, Building FD 3.037,6534 AE Nijmegen, The Netherlands. email: ; Ekkehard Miersch ; Martin Versleijen ; Sidina Wane

In this paper an application of an integral analysis technique is demonstrated for determining signal integrity (SI) and power integrity (PI) of complex and advanced package solutions. A representative system-in-package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and highlighted. Importance of balancing between accuracy, CPU time and ease-of-use is also underlined.

Published in:

2007 IEEE Electrical Performance of Electronic Packaging

Date of Conference:

29-31 Oct. 2007