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Application of Integral Analysis Technique to Determine Signal- and Power Integrity of Advanced Packages

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4 Author(s)
Nenadovic, N. ; NXP Semiconductors, Nijmegen ; Miersch, E. ; Versleijen, M. ; Wane, S.

In this paper an application of an integral analysis technique is demonstrated for determining signal integrity (SI) and power integrity (PI) of complex and advanced package solutions. A representative system-in-package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and highlighted. Importance of balancing between accuracy, CPU time and ease-of-use is also underlined.

Published in:

Electrical Performance of Electronic Packaging, 2007 IEEE

Date of Conference:

29-31 Oct. 2007