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Chip-to-Chip Optical Interconnection for Next-generation High-performance Systems

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4 Author(s)
Oda, M. ; NEC Corp., Sagamihara ; Sakai, J. ; Takahashi, H. ; Kouta, H.

Novel key devices,"high-speed and high-density optical modules," are developed. The optical modules were 12-channel on 4.5 mmtimes4.5 mm ceramic substrates. They worked successfully at 10 Gbps with an error rate of less than 1.0times10-12.

Published in:

Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE

Date of Conference:

21-25 Oct. 2007