By Topic

A Novel Design of Transcutaneous Power and Data Bidirectional Transfer System for Biomedical Implants

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Yang Zhou ; Department of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai 200240, P.R.China ; Jinhai Niu ; Ye Zhou ; Shuai Niu
more authors

Electrical stimulation of the optic nerve has been identified as a form of visual prosthesis to restore lost vision in blind patients affected by retinitis pigmentosa and age-related macular degeneration, through many studies and experiments. Magnetic transcutaneous coupling is frequently used for power transfer to implanted electronic devices. In such a prosthetic device, how to improve the power transfer efficiency and how we can get a precise DC voltage output are the two of the most challengeable elements in the whole system design. This paper presents the use of a transmitter coil driver based on the class-E amplifier. The closed-loop class-E circuit shows a great promise, especially for the circuits with unusually low coefficients of coupling. The transfer system is designed to a high-Q system and it can compensate for the transmitter and receiver variations via a smart feedback system. The system is optimized to minimize the power losses. This paper also describes the design of a data transfer system. This part can deliver the processed digital information that is useful for the implanted stimulator from the external side to the internal side (implant).

Published in:

Complex Medical Engineering, 2007. CME 2007. IEEE/ICME International Conference on

Date of Conference:

23-27 May 2007