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We explore a novel integration approach that introduces valence-mending adsorbates such as sulfur (S) or selenium (Se) by ion implantation and prior to nickel silicidation for the effective reduction of contact resistance and Schottky barrier (SB) height at the NiSi/n-Si interface. While a low SB height of ~0.12 eV can be obtained for NiSi formed on S-implanted n-Si, the insertion of a 1000degC anneal prior to silicidation leads to S out-diffusion and loss of SB modulation effects. We demonstrate that Se-implanted Si does not suffer from Se outdiffusion even after a 1000degC anneal, and subsequent Ni silicidation formed an excellent ohmic contact with a low SB height of 0.13 eV. Se segregation at the NiSi/n-Si (100) interface occurred. Implantation of Se and its segregation at the NiSi/n-Si interface is a simple and promising approach for achieving reduced SB height and contact resistance in future high-performance n-channel field-effect transistors.