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Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model

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4 Author(s)
Mu-Shui Zhang ; Xidian Univ., Xi''an ; Yu-Shan Li ; Li-Ping Li ; Chen Jia

In this paper, a new multisegment multiple transmission lines (MMTLs) SPICE model is developed to model and analyze high-speed and high-density connectors based on time domain reflectometry (TDR) measurements. It has advantages over the distributed inductance-capacitance (LC) model in aspects of stability and efficiency. The model is easy to understand and optimize. Its accuracy is easy to control. The precision function of the MMTL is extracted through simulations and measurements on which the modeling automation is based. Feedback theory is adopted to realize the automation process. Pro rata sampling method is introduced to reduce the variable space of the segments. Partial binary search method is applied to accelerate the search speed. With the novel modeling technique, a high accuracy model could be generated in a few minutes. The experimental results show that the proposed modeling method is of high accuracy and efficiency.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:31 ,  Issue: 1 )