Referenced Items are not available for this document.
Plasma etching removes material from a silicon wafer by applying power and gases in a chamber. As material is removed from a wafer, the amount of particular chemicals given off can be measured; this technique is called emission spectroscopy and the measurements are called endpoint traces. An expert system that automatically interprets the traces has been designed and built. The system combines signal-to-symbol transformations for data abstraction and rule-based reasoning for diagnosis. The system detects problems as soon as they occur and also determines their causes
Published in:
Semiconductor Manufacturing, IEEE Transactions on
(Volume:1
,
Issue:
1
)
Date of Publication: Feb 1988
- Page(s):
- 23 - 27
- ISSN :
- 0894-6507
- INSPEC Accession Number:
- 3155193
- Digital Object Identifier :
- 10.1109/66.4369
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Feb 1988
- Sponsored by :
- IEEE Components, Packaging and Manufacturing Technology Society
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