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We report the hot-carrier effects in a novel strained n-channel transistor (n-FET) featuring silicon-carbon source and drain (Si1-yCy S/D) stressors, and its dependence on channel orientations for the first time. Due to strain-induced bandgap reduction, Si1-yCy S/D n-FETs show enhanced impact ionization and therefore more pronounced drive current degradation over a control n-FET. As a consequence of the increased interface state generation, a strained n-FET with  channel shows worse hot-carrier reliability over a transistor with the conventional  channel, which leads to a larger shift in threshold voltage and subthreshold swing. In addition, a hot-carrier lifetime projection shows a dependence of operating drain voltage on the channel orientation of the strained n-FET.