Cart (Loading....) | Create Account
Close category search window
 

Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Kumbhat, N. ; Georgia Inst. of Technol., Atlanta ; Raj, P.M. ; Pucha, R.V. ; Jui-Yun Tsai
more authors

This paper presents the development and evaluation of a large-area carbon-silicon carbide (C-SiC) based composite board material that has the advantages of organic boards in terms of large-area processability and machinability at potentially low-cost while retaining the high stiffness (> 200 GPa) and Si-matched coefficient of thermal expansion (CTE) (~ 2.5 ppm/degC) of ceramics. Test vehicles were fabricated using C-SiC boards for assessing ultra-fine pitch solder joint reliability without underfill as well as the reliability of high-density wiring with microvias on the board. Finite element reliability models were developed to simulate the thermomechanical behavior of test vehicles. From the finite-element simulations as well as accelerated reliability tests, the high stiffness low-CTE C-SiC boards did not show any premature solder joint fatigue failure or dielectric cracking. Furthermore, the C-SiC boards show minimal via-pad misalignment and support the multilayer buildup structure required to achieve very high wiring density. The modeling and experimental results suggest that the low-cost large-area ceramic matrix composite (C-SiC) has superior thermomechanical properties, and is, therefore, a promising candidate substrate material for the emerging microelectronic systems.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:30 ,  Issue: 4 )

Date of Publication:

Nov. 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.