By Topic

Fabrication of Precise Die Edges for Micro-Optical and MEMS Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Swaroop Kommera ; Hewlett-Packard, Corvallis

A method for fabricating precise silicon die edges aligned to a precision of 0.5 mum to the features on the front side of the die without damaging these features is described in this paper. A two step die edge fabrication process with die edge defined by silicon DRIE on the front side of the die and edge grinding on the backside of the die was developed. The features on the front-side of the die close to the edge are not mechanically damaged by this technique. Test structure design and fabrication to measure the precision of die edge with respect to the features on the front side is discussed. Die cleaning process using a protective coating deposited prior to the sawing and grinding processes is also presented.

Published in:

IEEE Transactions on Advanced Packaging  (Volume:30 ,  Issue: 4 )