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An on-chip buck converter which is implemented by stacking chips and suitable for on-chip distributed power supply systems is proposed. The operation of the converter with 3-D chip stacking is experimentally verified for the first time. The manufactured converter achieves a maximum power efficiency of 62% for an output current of 70 mA and a voltage conversion ratio of 0.7 with a switching frequency of 200 MHz and a 2 times2 mm on-chip LC output filter. The active part and the passive LC output filter are implemented on separate chips fabricated in 0.35-mum CMOS and connected with metal bumps. The use of glass epoxy interposer to increase the maximum power efficiency up to 71.3% is also discussed.
Published in:
Solid-State Circuits, IEEE Journal of
(Volume:42
,
Issue:
11
)
Date of Publication: Nov. 2007
- Page(s):
- 2404 - 2410
- ISSN :
- 0018-9200
- INSPEC Accession Number:
- 9671193
- Digital Object Identifier :
- 10.1109/JSSC.2007.906204
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 22 October 2007
- Issue Date :
- Nov. 2007
- Sponsored by :
- IEEE Solid-State Circuits Society
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