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High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints

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5 Author(s)
Haiyu Qi ; Dept. of Portable Reliability Eng., Dell, Inc., Round Rock, TX ; Qian Zhang ; Tinsley, E.C. ; Osterman, M.
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In this study, a comprehensive experimental and numerical approach was used to investigate high cycle cyclic torsion fatigue behavior of lead-free solder joints in a plastic ball grid array (PBGA) package. The test vehicle was a commercial laptop motherboard. The motherboard was subjected to torsional loading and life tests were conducted. Using finite element analysis (FEA), the test assembly was simulated as a global model and the BGA component was simulated as a local model. Strains measured on the motherboard surface near by the BGA were used to calibrate the FEA models. By combining the life test results and FEA simulations, a high cycle fatigue model for the lead-free solder joints was generated based on the Coffin-Manson strain-range fatigue damage model. This model can now be used to predict the cycles to failure of BGA interconnects for new electronic product design under cyclic torsion loading.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:31 ,  Issue: 2 )

Date of Publication:

June 2008

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