By Topic

Acceleration Factors for Lead-Free Solder Materials

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Olli Salmela ; Nokia Networks, Espoo

In this paper, the acceleration factors for lead-free solder materials are discussed. The focus is on the analytical models proposed by Norris-Landzberg, Pan, and Salmela. As most reliability prediction models are originally created for eutectic SnPb solder material, it is expected that the models must be recalibrated in order to be useful in conjunction with lead-free solder materials. Pan et al. have reparameterized the Norris-Landzberg's model for SnAgCu already earlier. However, the data provided by Syed did not fit very well the reparameterized Norris-Landzberg model. An approach to explain this, and a benchmark of results based on alternative parameter value selections, is presented. The underlying assumptions related to the Norris-Landzberg's model and the applicability of the model in case of lead-free solders is discussed. Finally, an alternative form of Norris-Landzberg's equation is introduced and the fit of the existing experimental data to the proposed model is studied.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:30 ,  Issue: 4 )