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Prestressed Ceramic Coatings for Enhanced Reliability of Silicon Wafer Fracture Strength

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3 Author(s)
Yoder, K. ; Texas Instrum., Inc., Sherman ; Dwyer, M. ; D'Souza, N.

The objective of this paper is to investigate thin, solid, prestressed ceramic films as a means of enhancing the reliability of silicon semiconductor wafers stressed in bending. To characterize the effect of thin films on strength, one-micrometer ceramic films were deposited on wafers using plasma-enhanced chemical-vapor deposition. The modulus of rupture (MOR) of the coated wafers was determined from four-point bend testing of coated samples. Adhesion testing of the coated wafers primarily showed cohesive rather than adhesive failure. A series of residual stresses was introduced into the coating-silicon interface and the MOR was determined. The results showed that for a thin brittle coating (1 mum) on a silicon wafer (635 mum), the minimal shear stress at the surface led to dominance of the residual stress over intrinsic coating strength as the critical parameter affecting failure. A correlation between MOR and residual stress was established.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:30 ,  Issue: 4 )

Date of Publication:

Nov. 2007

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