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Deep-Trench Process Technology for Three-Dimensionally Integrated SOI-Based Image Sensors

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7 Author(s)
Young, D.J. ; Massachusetts Inst. of Technol., Lexington ; Knecht, J.M. ; Rathman, D.D. ; Warner, K.
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Large arrays of scientific imaging devices are in demand for wide-field-of-view imaging systems. We present a deep-trench process technology that enables the fabrication of SOI-based, 3-D-integrated, 4-side-abuttable image sensor "tiles" that can be assembled into large-area focal plane arrays. We demonstrate low-leakage, functional devices with 13.4-mum spacing between tile edge and the first imaging pixel.

Published in:

SOI Conference, 2007 IEEE International

Date of Conference:

1-4 Oct. 2007