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Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

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5 Author(s)
Coppola, L. ; Virginia Polytech. Inst. & State Univ., Blacksburg ; Huff, D. ; Wang, F. ; Burgos, R.
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High temperature SiC devices need the materials for device packages also capable of working at higher temperature than those for Si devices. This paper presents a selection of materials that are potentially suitable for use in high temperature package assembly, including die attach, substrate, interconnections, encapsulation, case, heat spreader and heat sink. The temperature under consideration is up to 250degC, corresponding to the need of many applications, including automobiles and aircraft.

Published in:

Power Electronics Specialists Conference, 2007. PESC 2007. IEEE

Date of Conference:

17-21 June 2007