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Corrosion Measurement of a Conductive Paste and Anisotropic Conductive Adhesive Films

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3 Author(s)
Osamu Ikeda ; Sony Corporation, 6-7-35 Kitashinagawa Shinagawa-ku, Tokyo, 141-0001 Japan, phone:+81 3 5795 5897 ; Yoshio Watanabe ; Fuminari Itoh

We measured corrosion layer thickness on a conductive paste (CP-Ag) and anisotropic conductive adhesive films (ACFs). CP-Ag consist of epoxy resin and silver powder, and ACFs consist of epoxy resin and about 4 mum in diameter of uniform plastics particles with Ni and Au/Ni plating. Firstly the conductive paste was printed on the polyimide film, and ACFs were bonded on the glass with indium-tin-oxide (ITO) electrodes. After thermal curing, these samples were set in the condition of an acceleration corrosion test; 2 ppm of H2S gas, 4 ppm of NO2 gas, 30degC, 70%RH. After exposure in corrosive gases for 77.3 hours, these samples were cut to analyze the resultant corrosion, using the SAICAS (surface and interfacial cutting analysis system) slant-cut method. The sulfur component in the cut section of each sample was measured by using both the scanning electron microscope (SEM) and the energy dispersive X-ray microanalysis (EDX) component analysis method. As a result, we found that the corrosion reached a depth of about 2 mum on CP-Ag. This depth is our predictive value. But on ACFs, the sulfur component was not found. Then ACFs were set in the condition of other acceleration corrosion test; 0.07 ppm of H2S gas, 1.4 ppm of NO2 gas, 1.4 ppm of SO2 gas, 0.07 ppm of Cl2gas, 35degC, 85%RH for 96 hours. The affection of corrosive gases reached in the depth of about 1.2 mum when we paid the attention about the weight ratio for oxygen and nickel.

Published in:

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics

Date of Conference:

Jan. 16 2007-Yearly 18 2007