Corrosion Measurement of a Conductive Paste and Anisotropic Conductive Adhesive Films

We measured corrosion layer thickness on a conductive paste (CP-Ag) and anisotropic conductive adhesive films (ACFs). CP-Ag consist of epoxy resin and silver powder, and ACFs consist of epoxy resin and about 4
μ
m in diameter of uniform plastics particles with Ni and Au/Ni plating. Firstly the conductive paste was printed on the polyimide film, and ACFs were bonded on the glass with Indium-Tin-Oxide (ITO) electrodes. After thermal curing, these samples were set in the condition of an acceleration corrosion test; 2 ppm of H
₂
S gas, 4 ppm of NO
₂
gas, 30°C, 70%RH. After exposure in corrosive gases for 77.3 hours, these samples were cut to analyze the resultant corrosion, using the SAICAS (Surface and Interfacial Cutting Analysis System) slant-cut method. The sulfur component in the cut section of each sample was measured by using both the Scanning Electron Microscope (SEM) and the Energy Dispersive X-ray microanalysis (EDX) component analysis method. As a result, we found that the corrosion reached a depth of about 2
μ
m on CP-Ag. This depth is our predictive value. But on ACFs, the sulfur component was not found. Then ACFs were set in the condition of other acceleration corrosion test; 0.07 ppm of H
₂
S gas, 1.4 ppm of NO
₂
gas, 1.4 ppm of SO
₂
gas, 0.07 ppm of Cl
₂
gas, 35°C, 85%RH for 96 hours. The affection of corrosive gases reached in the depth of about 1.2
μ
m when we paid the attention about the weight ratio for oxygen and nickel.