By Topic

Recipe for a Science Happening: 1 Volunteer Engineer, 1 Teacher, 30 Youngsters-Blend in Lots of Love and a Pinch of Humor

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Engineers can play a special role in society. Working in industry, the corporation's sphere of influence can act as a lever for a contributing professional individual. Hence, the engineer is able to exert a greater force on the world than most other people. With technology carrying us away at a rapid (and some think devastating) rate, the need for socially responsible professional people is becoming more crucial. Many believe that members of minority groups can make an effective contribution to the modern social engineering concerns that confront us. There are several programs currently underway by colleges, government, and industries to increase the flow of minorities into the engineering profession. This article discusses two programs whose purpose is to promote an interest for engineering and science in youngsters. First, the Science Consultant Program-sponsored by Xerox Corporation. The SCP is a volunteer program that gives elementary school students a first-hand look at science by bringing scientists, technicians, and engineers to the inner-city classrooms. Second, the Junior Engineering Technical Society which works through school sponsored clubs and projects to provide engineering oriented career guidance to high school students.

Published in:

Education, IEEE Transactions on  (Volume:18 ,  Issue: 1 )