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Strained p-Channel FinFETs With Extended Π -Shaped Silicon–Germanium Source and Drain Stressors

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8 Author(s)
Kian-Ming Tan ; Nat. Univ. of Singapore, Singapore ; Tsung-Yang Liow ; Lee, R. ; Keat Mun Hoe
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Further enhancement of performance in a strained p-channel multiple-gate or fin field-effect transistor (FinFET) device is demonstrated by utilizing an extended-Pi-shaped SiGe source/drain (S/D) stressor compared to that utilizing only Pi-shaped SiGe S/D. With the usage of a longer hydrofluoric acid cleaning time prior to the selective-epitaxy-raised S/D growth, a recess in the buried oxide is formed. This recess allows the subsequent SiGe growth on the fin sidewalls of the S/D regions to extend into the recessed buried oxide to provide a larger compressive stress in the channel for enhanced electrical performance compared to a device with SiGe S/D stressor. Process simulation shows that longitudinal compressive stress in the channel region is higher in a FinFET with extended-Pi-SiGe S/D than that with Pi-SiGe S/D. An enhancement of 26% in the drive current was experimentally observed, demonstrating further boost in enhancement of strained p-channel FinFET with little additional cost using this novel process.

Published in:

Electron Device Letters, IEEE  (Volume:28 ,  Issue: 10 )