By Topic

Higher Reliability for Hybrids and Printed Circuit Boards by Functional Thermal Testing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

Thermal cycling of functioning electronic assemblies has proven to be a means to enhance field-reliability. This paper describes a unique testing device which proved to be both practical and cost-effective for performing rapid thermal cycling on automatic test equipment (ATE). By using liquid nitrogen for quick cooling and the resulting inert gas as the media to be blown across electronic assemblies, many gains were made in quick proof-of-design tests. A unique manual switching arrangement from a pair of commercially available chambers provides quick changeover from hot to cold ambient environment around the units under test (UUT). Adding blowers to each chamber for circulating the inert gas across the UUT achieves rapid temperature changes. New MIL specification requirements can now be met and the proven reliability enhancement techniques can now be used with any ATE. A programmed temperature cycle is also part of the features available from the Thermal Test Station (TTS) described.

Published in:

IEEE Transactions on Instrumentation and Measurement  (Volume:26 ,  Issue: 3 )