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3D System Integration Technologies

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2 Author(s)
Eric Beyne ; Members, IEEE ; Bart Swinnen

3D technologies hold the promise to further enable increased system performance in a time where scaling has become increasingly challenging. However, 3D technologies will need to be tailored to the needs of the application they will serve. This paper describes different 3D integration schemes that are currently investigated at IMEC.

Published in:

2007 IEEE International Conference on Integrated Circuit Design and Technology

Date of Conference:

May 30 2007-June 1 2007