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Highly miniaturised InP=InGaAs PIN MMIC switches using BCB-based multilayer technology

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3 Author(s)
Yang, J.G. ; Korea Adv. Inst. of Sci. & Technol., Daejeon ; Choi, S. ; Yang, K.

Fully integrated single-pole-double-throw and single-pole-triple-throw InP/InGaAs PIN switches have been designed and fabricated using a newly proposed BCB-based 3D MMIC technology. The chip sizes of the fabricated InP/InGaAs PIN switches, which show good and broadband RF characteristics, have been significantly reduced compared to those of conventional GaAs-based switches. The results indicate the potential of the proposed 3D MMIC technology for compact embedded MMIC applications.

Published in:

Electronics Letters  (Volume:43 ,  Issue: 18 )