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Miniaturized environmental sensor chips for data gathering are useful for various applications, such as anthropometric or body-motion measurement. In this study, we propose a microelectromechanical system (MEMS) multi-sensor for environmental sensing. The system includes a sensor and peripheral interface circuitry chips. The sensor chip has a 3-axis accelerometer, with a pressure sensor and a humidity sensor. All sensors are built on a 10 times 5 mm2 silicon-on-insulator SOI) wafer by the bulk MEMS process using deep reactive-ion etching RIE). The interface circuitry for each sensor is produced on a semi-custom Bi-CMOS application specific integrated circuit ASIC) chip by a Japanese IC foundry service of MICS.
Date of Conference: 6-8 June 2007