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SOI-MEMS Sensor for Multi-Environmental Sensing-System

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4 Author(s)
Takayuki Fujita ; Dept. of Electrical Engineering and Computer Sciences, Graduate school of Engineering, University of Hyogo, Himeji, Hyogo, JAPAN. Email: fujita@eng.u-hyogo.ac.jp ; Yosuke Fukumoto ; Fumiaki Suzuki ; Kazusuke Maenaka

Miniaturized environmental sensor chips for data gathering are useful for various applications, such as anthropometric or body-motion measurement. In this study, we propose a microelectromechanical system (MEMS) multi-sensor for environmental sensing. The system includes a sensor and peripheral interface circuitry chips. The sensor chip has a 3-axis accelerometer, with a pressure sensor and a humidity sensor. All sensors are built on a 10 times 5 mm2 silicon-on-insulator SOI) wafer by the bulk MEMS process using deep reactive-ion etching RIE). The interface circuitry for each sensor is produced on a semi-custom Bi-CMOS application specific integrated circuit ASIC) chip by a Japanese IC foundry service of MICS.

Published in:

2007 Fourth International Conference on Networked Sensing Systems

Date of Conference:

6-8 June 2007