Cart (Loading....) | Create Account
Close category search window
 

Theoretical and Experimental Thermal Analysis of InP Ridge Lasers on Submounts and TO Packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

We have determined the junction temperatures of laser diodes mounted on ceramic submounts and hermetic transistor-outline (TO) packages using data from wavelength-shift measurement as well as finite-element modeling (FEM). We found that the difference in the junction temperature between chip/submount and chip/submount/TO measured at the free-standing room-temperature condition cannot be used as the reference data for the design of accelerated life-test condition at hot oven. For the free-standing condition, the heat spread from the active region of the chip to the chip substrate, submount, and TO. Hence, there was an additional thermal gradient in the chip/submount/TO arising from the thermal impedance of the TO header. For the oven condition, the heat dissipation via forced convection from the outer surface of the TO was important. Hence, the thermal gradient of the TO resulting from heat conduction became smaller. Using the FEM, we showed that the simulated junction temperature was in close agreement with the experimental value. The heating difference between the chip/submount and chip/submount/TO was smaller at the oven condition than at the free-standing condition.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:7 ,  Issue: 2 )

Date of Publication:

June 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.