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Processor Design in 3D Die-Stacking Technologies

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3 Author(s)
Gabriel H. Loh ; Georgia Institute of Technology ; Yuan Xie ; Bryan Black

Three-dimensional integration is an emerging fabrication technology that vertically stacks multiple integrated chips. The benefits include an increase in device density; much greater flexibility in routing signals, power, and clock; the ability to integrate disparate technologies; and the potential for new 3D circuit and microarchitecture organizations. This article provides a technical introduction to the technology and its impact on processor design. Although our discussions here primarily focus on high-performance processor design, most of the observations and conclusions apply to other microprocessor market segments.

Published in:

IEEE Micro  (Volume:27 ,  Issue: 3 )