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Integrated RF Passive Filtering Circuits in Organic Package Substrate

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3 Author(s)
XiangYin Zeng ; Intel Technology Development (Shanghai) Ltd, 1111 Yinglun Road, Shanghai, 200131, China, ; Telesphor Kamgaing ; Emile Davies-venn

Integration of RF passive components like filter, diplexer and matching network on organic substrate are discussed in this paper. These passives are composed of a few lumped elements, mainly inductors and capacitors, which are realized using wind traces or parallel plate with high-k dielectric material sandwiched between them. A few test samples have been fabricated on a multi-layer organic substrate. Measurement results based on two-port VNA have been compared with HFSS simulation results. Good agreement has been observed except that measurement shows more loss in the pass band than the simulation prediction.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007