Skip to Main Content
Integration of RF passive components like filter, diplexer and matching network on organic substrate are discussed in this paper. These passives are composed of a few lumped elements, mainly inductors and capacitors, which are realized using wind traces or parallel plate with high-k dielectric material sandwiched between them. A few test samples have been fabricated on a multi-layer organic substrate. Measurement results based on two-port VNA have been compared with HFSS simulation results. Good agreement has been observed except that measurement shows more loss in the pass band than the simulation prediction.