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Technology of Stacking Vertical Interconnecting Micro-Assembly

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3 Author(s)
Zhang Bao ; State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin 300072, China. Email: zhangbao ; Wang Zhong ; Wang Xiangjun

Vertical interconnecting can effectively reduce the substantial size and increase the interconnecting ability and accessibility It is one of the most important trends of the novel assembly technology. Based on the characteristics of 3-D packaging and cubic assembly technology, this paper studies the stacking vertical interconnecting assembly technology. Vertical interconnecting of electronic packaging module with both-sides electrodes and transfer layer with circuit transferring function can make the circuit chips stack along z-axis, forming a kind of microelectronic system of stacking assembly. Experiment shows that this method can greatly shorten the interconnecting length of chips and reduce the area and cubage, and both-sides electrodes and transfer layer are the key to success.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007