By Topic

Stress Reduction of Epoxy Molding Compound and Its Effect on Delamination

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Xinyu Du ; Henkel Huawei Electron. Co., Ltd., Lianyungang ; Guangchao Xie ; Wei Tan ; Suqiong Qin
more authors

Thermal stress in a semiconductor package is one of the major causes of delamination during stress testing. The influence of epoxy molding compound (EMC) properties on package interfacial stress was studied in this paper. Stress index was calculated based on the tested EMC properties. It was found that there is optimized filler content to get the lowest stress. Type of stress modifier is another important raw material in EMC formulations for stress reduction purpose. With certain types of stress modifier, the stress index can be reduced 2 times. The adhesion to lead frame finishing was also measured to understand the effect of stress on interface adhesion strength. All the finished material was molded on a SOIC 20L test vehicle and soaked with a Jedec MSL 3 condition. Delamination was checked after soaking and reflows. It was found delamination to lead frame is strongly related to stress index.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007