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Reliability Analysis of SiP Structures

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4 Author(s)
Bailey, C. ; Sch. of Comput. & Math. Sci., Greenwich Univ., London ; Stoyanov, S. ; Strusevich, N. ; Yannou, J.-M.

This presentation discusses latest developments in SiP technology and the challenges for design in terms of manufacture and reliability. It presents results from a UK government funded project that aims to develop modelling techniques that will assess the thermo-mechanical reliability of SiP structures such as (i) stacked die, (ii) side-by-side dies and (iii) embedded die. Finite element analysis coupled with numerical optimisation and uncertainty analysis is used is used to model the reliability of a particular package design. In particular, the damage (energy density) in the lead free solder interconnects under accelerated temperature cycling is predicted and used to observe the fatigue life-time. Warpage of the structure is also investigated.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007

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