By Topic

Tin Whiskers: How to Mitigate and Manage the Risks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Mathew, S. ; Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD ; Osterman, M. ; Shibutani, T. ; Qiang Yu
more authors

The selection of lead-free tin based surface finishes resulting from government regulation of lead has reintroduced, into the spotlight, the reliability concern due to the possible formation of electrically conductive tin whiskers. This paper reviews risk mitigation studies including use of tin alloys, conformal coating, electroplating techniques, surface treatment, annealing, and use of under-layer material. This paper also discusses approaches to manage the risk due to tin whiskers.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007