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Tin Whiskers: How to Mitigate and Manage the Risks

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5 Author(s)
Mathew, S. ; Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD ; Osterman, M. ; Shibutani, T. ; Qiang Yu
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The selection of lead-free tin based surface finishes resulting from government regulation of lead has reintroduced, into the spotlight, the reliability concern due to the possible formation of electrically conductive tin whiskers. This paper reviews risk mitigation studies including use of tin alloys, conformal coating, electroplating techniques, surface treatment, annealing, and use of under-layer material. This paper also discusses approaches to manage the risk due to tin whiskers.

Published in:

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Date of Conference:

26-28 June 2007

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