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Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers in a SiP structure. Ink-jet printing with Ag nano particle pastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.