By Topic

LF55GN Photosensitive Flexopolymer: A New Material for Ultrathick and High-Aspect-Ratio MEMS Fabrication

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sayah, A. ; Swiss Fed. Inst. of Technol. Lausanne, Lausanne ; Parashar, V.K. ; Gijs, M.A.M.

A growing interest in the development of thick functional structures with high aspect ratio for microelectromechanical system (MEMS) applications has triggered the investigation of several polymer materials. This paper presents LF55GN flexopolymer material as a new negative-tone photoresist to fabricate ultrathick MEMS microstructures. Up to 4-mm-thick layers are obtained using a casting method in a single photolithography step. Standard UV illumination is used to polymerize such thick microstructures in less than 1 min and with an aspect ratio up to 27. We have fabricated microstructures on rigid, flexible, and stepped substrates. Using oblique UV exposure, tilted pillars are achieved with an angle of 25deg to the substrate normal. Due to the elastomeric nature of the LF55GN flexopolymer, the microstructures can be easily deformed without causing any stress-related problems.

Published in:

Microelectromechanical Systems, Journal of  (Volume:16 ,  Issue: 3 )