By Topic

Investigation of High-Voltage MOSFET Reliability in IKIRK Region

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

This paper evaluates the hot-carrier performance of the n-channel high-voltage (30 V) MOSFET device. This device is widely used in high-voltage linear products. It can withstand 30 V across any two terminals. This large voltage range requires thorough hot-carrier analysis, investigating potential hot-carrier mechanisms not believed to have been previously explored in the literature. It is established that two different hot-carrier generation mechanisms are occurring: one at ISUB(max) and another at IKIRK. These are investigated through combined device parametric, technology computer-aided design (TCAD) simulation, and hot-carrier reliability data.

Published in:

Device and Materials Reliability, IEEE Transactions on  (Volume:7 ,  Issue: 1 )