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State-of-the-art device simulation is applied to the analysis of possible scaling strategies for the future CMOS technology, adopting the ultrathin silicon body (UTB) double-gate (DG) MOSFET and considering the main figures of merit (FOM) for the high-performance N-MOS transistor. The results of our analysis confirm the potentials of UTB-DG MOSFETs. In particular, the possibility to control the short-channel effects by thinning the silicon layer is fully exploited allowing to adopt almost undoped silicon channel, leading to reduced transversal field. As a consequence, the impact of surface roughness at the Si-oxide interface and the gate tunneling leakage current are substantially reduced compared to the case of highly doped bulk MOSFETs. According to our results, thanks to the suppression of gate leakage current, scaling of the UTB-DG MOSFET down to the 32 nm technology node appears possible adopting -based gate dielectrics. In spite of the improved mobility at given inversion charge density, the simulated on-currents are substantially lower than those required by the 2005 ITRS for the 45 and 32 nm nodes . Nonetheless, thanks to relaxed scaling of the oxide thickness, hence to reduced gate capacitance, the requirements in terms of intrinsic delay and power-delay product can be satisfied. The issue of variability is analyzed by evaluating the dependence of the key FOM on the variation of critical dimensions such as the thickness of the gate oxide and of the silicon layer.