Close category search window
 

An Enhancement of Decimation Process using Fast Cascaded Integrator Comb (CIC) Filter

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Teymourzadeh, R. ; Univ. Kebangsaan Malaysia, Bangi ; Bin Othman, M.

The over sampling technique has been shown to increase the SNR and is used in many high performance system such as in the ADC for audio and DAT systems. This paper presents the design of the decimation and its VLSI implementation which is the subcomponent in the over sampling technique. The design of three main units in the decimation stage that is the cascaded integrator comb (CIC) filter, the associated half band filters and the droop correction are also described. The Verilog HDL code in Xilinx ISE environment has been derived to describe the CIC filter properties and downloaded in to Virtex II FPGA board. In the design of these units, we focus on the trade-off between the speed improvement and the power consumption as well as the silicon area for the chip implementation.

Published in:
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on

Date of Conference: Oct. 29 2006-Dec. 1 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.