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Simulation on Vertical Via Interconnection Using Matrix-penciled Moment Method in Microwave Multi-Chip Module

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3 Author(s)
Ji Wu-sheng ; Xidian Univ., Xian ; Xiao Jian-kang ; Xie Yong-jun

In the multi-chip module, signal transmission lines such as striplines or microstrip lines at different layers are connected through vias. It is very important to research the characteristics of via because of the signal transmission discontinuity it induced. In this paper, the matrix-penciled moment method is applied to analyze and compute the scattering parameters of via in a multi-layered module, and some important laws of scattering characteristics of the via are obtained, and the correctness of the calculated results are demonstrated as well.

Published in:

Microwave and Millimeter Wave Technology, 2007. ICMMT '07. International Conference on

Date of Conference:

18-21 April 2007