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High Value Passive Component Integration in LTCC Technology

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2 Author(s)
Hoppenjans, E.E. ; Purdue Univ., West Lafayette ; Chappell, W.J.

This paper presents the use of a unique component geometry to fabricate large valued inductors buried in an LTCC substrate. The large valued inductors presented create a self shielding buried component that require no external shields to isolate the inductor from other components in the circuit. As a demonstration of the usefulness of such a component, an example SAW filter matching circuit is discussed. The performance of the SAW filter and integrated matching circuit is also presented.

Published in:

Microwave Symposium, 2007. IEEE/MTT-S International

Date of Conference:

3-8 June 2007