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In this paper a new concept of integrating micromachined high-resistivity (HR) silicon dielectric resonator antennas (DRAs) compatible with a millimeter wave multichip module deposited (MCM-D) process based on multiple layers of benzocyclobuthene (BCB) is presented. The HR Si wafer is used not only as a carrier substrate for the BCB but also for manufacturing of the integrated antenna elements. A 4times8 focal plane array (FPA) was designed for use in a 94 GHz imaging radar system. Each channel uses a small 2times2 DRA subarray as feed element. By using the presented antenna a higher impedance bandwidth and radiation efficiency can be attained compared to the use of microstrip antennas. An improved isolation between the antennas and the feed lines/active circuits is also realized.