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Densification of Carbon Nanotube Bundles for Interconnect Application

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7 Author(s)
Liu, Z. ; Rensselaer Polytech. Inst., Troy ; Bajwa, N. ; Ci, L. ; Lee, S.H.
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We demonstrated a post-growth processing method to increase the site density of carbon nanotube (CNT) bundles, a critical step towards CNT interconnect for use in future ICs. CVD-grown CNT bundles are immersed in an organic solvent, then withdrawn from the liquid bath by solvent evaporation, and consequently compacted. The CNT site density is increased 5~25 times. Influences of bundle structure parameters on densification are discussed and the interconnect implementation of densified CNTs is presented.

Published in:

International Interconnect Technology Conference, IEEE 2007

Date of Conference:

4-6 June 2007