A Low-Latency and High-Power-Efficient On-Chip LVDS Transmission Line Interconnect for an RC Interconnect Alternative

This paper demonstrates a low voltage differential signaling (LVDS)-type on-chip transmission line (TL) interconnect to solve delay issues on a global interconnect. The proposed TL interconnect can achieve 10 Gbps signaling with 2.7 mW power consumption. The on-chip LVDS TL interconnect has the best power efficiency for on-chip interconnects at over 1 mm. Delay variation of the TL interconnect is 89 % smaller than that of the conventional RC interconnect.