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For the first time, an optimization methodology has been presented for power distribution interconnects at the local level. For a given IR drop budget, compact models are presented for the optimal widths of power and ground lines in the first two metal levels for which the total metal area used for power distribution is minimized. Wire widths and thicknesses at the end of the ITRS are projected to scale down to 14 nm, and size effects are expected to increase copper resistivity by more than 4 times. Either a 3 times increase in wiring area for local power lines or a 2 times decrease in the power via pitch is necessary to compensate for size effects.