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Distributed RLC Interconnect: Analytical Modelling Expressions for Crosstalk Noise Estimation

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2 Author(s)
Kadim, H.J. ; Liverpool JM Univ., Liverpool ; Coulibaly, L.M.

As the chip dimensions increase with chip complexity, interconnects tend to get longer. With the longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive coupling effects have become non-negligible. Analytical modelling expressions for the estimation of the noise peak voltage of the victim line under worst-case crosstalk noise effect are presented.

Published in:
Electronics, Circuits and Systems, 2006. ICECS '06. 13th IEEE International Conference on

Date of Conference: 10-13 Dec. 2006

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