Referenced Items are not available for this document.
The article describes the wafer yield loss due to wafer backside defect. The backside defect pattern will transfer to the next wafer surface during the following clean process and cause the process defect issue. These defects will impact the yield. Real root cause finding let prevent action work well.
Published in:
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Date of Conference: 11-12 June 2007
- Page(s):
- 58 - 60
- E-ISBN :
- 1-4244-0653-6
- Print ISBN:
- 1-4244-0652-8
- INSPEC Accession Number:
- 9881771
- Conference Location :
- Stresa
- Digital Object Identifier :
- 10.1109/ASMC.2007.375081
- Product Type:
- Conference Publications
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